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Erschienen in:
21.04.2016 | Original Article
Thermotransduction and heat stress in dental structures during orthodontic debonding
Effectiveness of various cooling strategies
Erschienen in: Journal of Orofacial Orthopedics / Fortschritte der Kieferorthopädie | Ausgabe 3/2016
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Objectives
Recent studies have indicated possible thermal damage to pulpal tissue during orthodontic debonding. This study aimed to analyze the thermal loads acting upon dental structures and their transfer to the pulp during orthodontic debonding. Specific goals were to analyze temperature changes in local dental tissues, thermotransduction to the pulp cavity, and the effectiveness of common cooling strategies and of simulated intrapulpal circulation.
Materials and methods
Metal brackets were bonded to five extracted human molars and subsequently removed. While a carbide bur was applied to debond the residual composite from the tooth surface, various cooling strategies (no/air/water cooling) were employed with or without simulated intrapulpal circulation, accompanied by temperature measurements with a thermographic infrared camera on the enamel surface and with measuring probes in the pulp cavity. Appropriate evaluation software was used to calculate the enamel-to-pulp temperature gradients and for statistical analysis.
Results
Significant differences in temperature rise and heat development over time, both on the enamel surfaces and in the pulp cavities were found. The mean temperature rises associated with no/air/water cooling were 90.7/46.6/9.2 °C on the enamel surface versus 9/8/4.6 °C inside the pulp. However, thermotransduction from enamel to pulp remained below 10 % of the surface measurements in all groups. Simulated intrapulpal microcirculation was found to significantly reduce intrapulpal temperature levels.
Conclusion
During debonding of residual bracket adhesives, provided that a carbide bur is properly used, our data indicate a low risk of reaching critical intrapulpal temperatures even in the absence of dedicated cooling and no risk if the instrumentation is accompanied by air or water cooling.